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En casa > Productos >
Máquina del PWB Depaneling del laser
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300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

Nombre De La Marca: Winsmart
Número De Modelo: SMTL300
Moq: 1 juego
Precio: USD1-150K/set
Detalles Del Embalaje: caja de madera contrachapada
Términos De Pago: LC, T/T, Unión Occidental
Información Detallada
Lugar de origen:
Porcelana
Certificación:
CE
Material PCB:
FR4 FPC
Fuente láser:
UV de 25 W
Mesa de trabajo:
300x300 mm, mesas dobles
Artículos fijos:
Personalizado
Longitud de onda:
355 nm
Nombre:
Máquina ULTRAVIOLETA del PWB Depaneling del laser
Capacidad de la fuente:
100 conjuntos por mes
Descripción del Producto

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling

 

Un buen precio.  en línea

Detalles De Productos

En Casa > Productos >
Máquina del PWB Depaneling del laser
>
300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

Nombre De La Marca: Winsmart
Número De Modelo: SMTL300
Moq: 1 juego
Precio: USD1-150K/set
Detalles Del Embalaje: caja de madera contrachapada
Términos De Pago: LC, T/T, Unión Occidental
Información Detallada
Lugar de origen:
Porcelana
Nombre de la marca:
Winsmart
Certificación:
CE
Número de modelo:
SMTL300
Material PCB:
FR4 FPC
Fuente láser:
UV de 25 W
Mesa de trabajo:
300x300 mm, mesas dobles
Artículos fijos:
Personalizado
Longitud de onda:
355 nm
Nombre:
Máquina ULTRAVIOLETA del PWB Depaneling del laser
Cantidad de orden mínima:
1 juego
Precio:
USD1-150K/set
Detalles de empaquetado:
caja de madera contrachapada
Tiempo de entrega:
5-30 días
Condiciones de pago:
LC, T/T, Unión Occidental
Capacidad de la fuente:
100 conjuntos por mes
Descripción del Producto

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling